Semiconductor industry professional terms and abbreviations

​ Advanced packaging is a major technological highlight of the "More than Moore" era. As chip miniaturization becomes increasingly challenging and costly at ea……

Due to the complexity of semiconductor manufacturing processes, different equipment is required for various steps. From a process classification perspective, semiconductor equipment can be mainly divided into silicon wafer production process equipment, wafer manufacturing process equipment, packaging process equipment,……

In modern industrial production, especially in automated processes, sensors are almost indispensable. Specifically, industrial producers need to use various sensors to monitor and control various parameters in the production process, ensuring that equipment operates normally and any faults can be promptly detected.

Flip chip technology originated from IBM, which developed the process of creating bumps on chips for flip chip soldering in 1960. The process involved surrounding the bumps with 95Pb5Sn encasing electroplated NiAu bumps. Later, PbSn bumps were used, employing Controlled Collapse Component Connection (C4) technology, in……

The bipolar junction transistor was invented by a research team at Bell Laboratories in 1947. The first transistor consisted of two metal wires with sharp endpoints making point contact with a germanium substrate. While primitive by today's standards, this first transistor significantly transformed the entire electroni……

In daily life, all objects can be roughly classified by their electrical conductivity into three categories: conductors, semiconductors, and insulators. This is easy to understand; objects either conduct electricity, do not conduct electricity, or conduct a little bit. It is precisely these materials that are ambiguou……

Explanation of Common Semiconductor Defect Terminology

Photolithography technology, as a precision microfabrication process, involves transferring meticulously designed micro-patterns onto photosensitive materials. At its core, it utilizes photolithography machines to accurately project patterns onto substrates, enabling the precise manufacturing of microstructures.

Parasitic Capacitance and Temperature Characteristics of MOSFET

​Semiconductor materials are at the core of the semiconductor industry, serving as the foundation for manufacturing electronic and computer chips. There is a wi……

Introduction: Electronic devices are a very complicated system. The defects and failures of the packaging process are also very complicated. Therefore, the research packaging defect and failure need to have a systematic understanding of the packaging process, so as to analyze the causes of defects from multiple angles.……