Global Semiconductor Industry Updates

1. The global top ten chip design companies are expected to generate $249.8 billion in revenue in 2024, a 49% year-on-year increase. Among them, Nvidia is the largest contributor, with a remarkable 125% growth, significantly outpacing other companies.

2. Samsung Electronics has introduced its first “High NA EUV lithography machine” — EXE:5000, produced by ASML, with a value of up to 500 billion Korean Won (approximately 25.01 billion RMB).

3. In Q4 2024, the top ten foundries collectively saw a near 10% quarter-on-quarter revenue increase, reaching $38.48 billion, setting a new record.

4. Kinghelm (www.kinghelm.net) and Saco Micro successfully completed their 2025 Spring Festival essay contest. After unanimous selection by leaders and colleagues, “Kinghelm Yang Bo: Encountering Wanzhou, Exploring the City Where Mountains, Water, and Fireworks Intertwine” and “Slkor Liu Mingying: Twelve Hours of Chang'an” were awarded the "Best Essay Award," and General Manager Song Shiqiang presented them with a prize of 1,000 RMB each.

6. Porsche Automobile Holding is expected to incur a tax loss of about 20 billion euros (approximately 157 billion RMB) in the fiscal year 2024.

China Semiconductor Industry Updates

1. The Suzhou Municipal Bureau of Industry and Information Technology is publicly soliciting opinions on the draft "Several Measures for Accelerating the Development of the AI Chip Industry in Suzhou."

2. TSMC is in talks with semiconductor giants such as Nvidia, AMD, and Broadcom to explore the possibility of jointly investing in a joint venture to operate Intel’s foundry business.

3. North Huachuang plans to take control of ChipSource Micro in two phases.

4. Lenovo aims to achieve full local PC manufacturing in the Indian market within the next three years.

5. Tsinghua Unigroup has selected BNP Paribas, CCB International, and CITIC Securities to arrange its second listing in Hong Kong, potentially raising around $1 billion through an IPO.

6. TSMC will invest up to $1.65 billion in Arizona, USA, to build several advanced packaging centers and a large R&D facility.