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CIS packaging technology

release time:2022-03-17Author source:SlkorBrowse:1358

CIS package was originally made of ceramic package with glass cover, for example, Amkor's VisionPak is a ceramic lead-free chip carrier. This scheme is expensive and takes up a lot of space in the camera. At the end of 20th century, the Wafer Level Package, WLP) technology developed gradually, and its advantages are small size, light weight and low cost, which gradually attracted people's attention. In March, 2007, Toshiba Company of Japan exhibited WLP's small graphic sensor module with through-silicon via technology for the first time. This technology not only provided completely closed devices for module integration, which greatly reduced the CIS yield loss caused by contaminated particles, but also had the advantages of minimum size and mass, effectively reducing parasitic effects, improving chip running speed and reducing power consumption [11-12]. At present, only four OSAT (outsourced semiconductor assembly and testing), a subsidiary of TSMC, namely Jingcai Technology, Huatian Technology (Kunshan) Electronics Co., Ltd., Jingfang Technology and Keyangguang Power Company, can provide WLP solutions for image sensors, among which only Huatian Technology (Kunshan) and Jingfang Technology can provide WLP services for 300 mm(12 inches) image sensors. Table 1 lists the major suppliers in all aspects of CIS in the world.

Table 1 Main manufacturers in each link of CIS






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