Features

• Low profile package.

• Ideal for automated placement.

• Ultrafast reverse recovery time.

• Low power losses,high efficiency.

• Low forward voltage drop.

• High surge capability.

• High temperature soldering: 260C/10 seconds at terminals.

Mechanical Date

• Case: JEDEC DO-214AC molded plastic body over glass passivated chip

• Terminals: Solder plated,solderable per J-STD-002B and JESD22-B102D