Service hotline
+86 0755-83044319
Features
Low profile package.
Ideal for automated placement.
Ultrafast reverse recovery time.
Low power losses,high efficiency.
Low forward voltage drop.
High surge capability.
High temperature soldering: 260C/10 seconds at terminals.
Mechanical Date
Case: JEDEC DO-214AC molded plastic body over glass passivated chip
Terminals: Solder plated,solderable per J-STD-002B and JESD22-B102D
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