International News:

1. The South Korean government is currently reviewing policy support for key materials, components, and equipment used in HBM chip manufacturing, which may include tax incentives, to strengthen its leading position in the global semiconductor industry.

2. Rapidus, a Japanese semiconductor manufacturer, has begun construction on its Hokkaido wafer plant, with plans to start trial production of 2-nanometer AI chips in 2025 and full production in 2027.

3. World Advanced and NXP will jointly establish a 12-inch semiconductor wafer manufacturing plant in Singapore, with a total investment of $7.8 billion. The plant is set to begin mass production in 2027.

4. NVIDIA will continue to expand its presence in Taiwan, with plans to establish a research and development center within five years and to set up a second AI supercomputer center similar to Taipei-1.

5. Kinghelm (www.kinghelm.net) official Weibo account "Kinghelm Connects the World" has released an article titled "Song Shiqiang Discusses Why There Are Many Millionaires in Huaqiangbei."

6. SK Hynix will enhance its collaboration with TSMC in the high-bandwidth memory (HBM) domain to boost the competitiveness of AI semiconductors.

China News:

1. On June 6th, Jiangsu LuXin Semiconductor Company held a topping-out ceremony for its new factory and supporting facilities project, with a planned investment of 2 billion yuan, aiming to address the domestic shortage of high-end chips.

2. On June 6th, Shengjian Environment's domestic semiconductor process equipment and key component project held a topping-out ceremony, with a total estimated investment of 600 million yuan.

3. Recently, the Beijing Integrated Circuit Industry-University-Research Integration Base project has entered a new stage of above-ground steel structure construction, with an expected completion date in September 2025.

4. Recently, the China-Singapore Semiconductor Industry Fund project was officially signed, with a target total scale of 1.001 billion yuan, mainly focusing on investments along the packaging industry chain.

5. On June 5th, Xingan Technology's third-generation semiconductor power module R&D production base project was signed and settled in Xidong New City, with a total investment exceeding 1 billion yuan and production expected to commence in 2025.

6. On June 7th, Alibaba's Qwen2 large-scale model for Thousand Questions with One Answer (Qwen2) was officially released. The Qwen2 series covers five sizes of pre-trained and instruction fine-tuned models, with a maximum context length of up to 128K tokens.