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Technical Information for semiconductors and electronics.
  • Updated: 2024-05-17
  • Views: 896
Nevada, California - Manufacturing Market Insider, a news publication focused on the Electronics Manufacturing Services (EMS) industry, has released its annual MMI Top 50™ Global EMS Providers list. In 2023, the Top 50 recorded sales of $423 billion, a decrease of $26 billion.
  • Updated: 2024-05-17
  • Views: 731
Top 10 global semiconductor companies
  • Updated: 2024-05-15
  • Views: 553
Shortly after Musk's visit to Beijing, the China Association of Automobile Manufacturers and the National Computer Network Emergency Response Coordination Center issued a notice on the testing of four security requirements for automobile data processing. Tesla, as a foreign-funded enterprise, became one of the first ba……
  • Updated: 2024-04-08
  • Views: 1309
Semiconductor industry professional terms and abbreviations
  • Updated: 2024-03-22
  • Views: 1449
​ Advanced packaging is a major technological highlight of the "More than Moore" era. As chip miniaturization becomes increasingly challenging and costly at ea……
  • Updated: 2024-03-22
  • Views: 1424
Due to the complexity of semiconductor manufacturing processes, different equipment is required for various steps. From a process classification perspective, semiconductor equipment can be mainly divided into silicon wafer production process equipment, wafer manufacturing process equipment, packaging process equipment,……
  • Updated: 2024-03-22
  • Views: 1347
In modern industrial production, especially in automated processes, sensors are almost indispensable. Specifically, industrial producers need to use various sensors to monitor and control various parameters in the production process, ensuring that equipment operates normally and any faults can be promptly detected.
  • Updated: 2024-03-21
  • Views: 1327
Flip chip technology originated from IBM, which developed the process of creating bumps on chips for flip chip soldering in 1960. The process involved surrounding the bumps with 95Pb5Sn encasing electroplated NiAu bumps. Later, PbSn bumps were used, employing Controlled Collapse Component Connection (C4) technology, in……
  • Updated: 2024-03-21
  • Views: 1178
The bipolar junction transistor was invented by a research team at Bell Laboratories in 1947. The first transistor consisted of two metal wires with sharp endpoints making point contact with a germanium substrate. While primitive by today's standards, this first transistor significantly transformed the entire electroni……
  • Updated: 2024-03-20
  • Views: 1250
In daily life, all objects can be roughly classified by their electrical conductivity into three categories: conductors, semiconductors, and insulators. This is easy to understand; objects either conduct electricity, do not conduct electricity, or conduct a little bit. It is precisely these materials that are ambiguou……
  • Updated: 2024-03-14
  • Views: 1065
Explanation of Common Semiconductor Defect Terminology
  • Updated: 2024-03-13
  • Views: 1080
Photolithography technology, as a precision microfabrication process, involves transferring meticulously designed micro-patterns onto photosensitive materials. At its core, it utilizes photolithography machines to accurately project patterns onto substrates, enabling the precise manufacturing of microstructures.

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